Interconnect Routing

Spatial Packaging of Interconnected Components with Coupled Physical Interactions (SPI2) is an interdisciplinary project with the purpose of pushing the cutting edge of automated design tools. At its core, SPI2 problems involve the placement of both components and required interconnects inside 3D geometry. Additionally, these components and interconnects must obey some constraints. Possible physics constraints could include temperature limits or maximum electromagnetic interference. Additionally, the system must be possible to manufacture and maintain, which places limits on how and where components and interconnects can be placed. All of the constraints make finding solutions very difficult, but worthwhile, as there are many applications of SPI2 design. Altogether, SPI2 design problems present a very challenging, multi-faceted problem with many applications.

Publications

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